Copper Removal & Recovery From CMP Wastewater Slurry

Copper chemical-mechanical planarization (CuCMP) is a fabrication technique that uses chemical oxidation and mechanical abrasion to remove copper from wafers and achieve high planarity. Semiconductor technology foundries use CMP as a critical process in the production of wafers. This process produces a complex copper bearing wastewater containing a mixture of hydrogen peroxide, organics, and silica that complicates treatment options.