Copper Removal & Recovery from CMP Wastewater Slurry

Producing a More Sustainable CMP Operation

Executive Summary

Copper chemical-mechanical planarization (CuCMP) is a fabrication technique that uses chemical oxidation and mechanical abrasion to remove copper from wafers and achieve high planarity. Semiconductor technology foundries use CMP as a critical process in the production of wafers. This process produces a complex copper bearing wastewater containing a mixture of hydrogen peroxide, organics, and silica that complicates treatment options.

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