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Enhancing Efficiency and Sustainability in Semiconductor Manufacturing Processes
ElectraMet technology efficiently extracts copper from both concentrated and dilute metal waste streams, including chemical mechanical planarization (CMP) and WETS effluent. ElectraMet assures discharge compliance and optimum copper value return, while decreasing scope 3 GHG emissions. ElectraMet’s process produces pure copper to enable circularity.
ElectraMet has delivered a significant advancement in peroxide and ozone removal. For Microelectronics, these chemistries are critical for cleaning, removal, and etching processes, but they risk downstream asset health. ElectraMet’s chemical-free, self-regenerating solution significantly reduces both physical and carbon footprint.
Sustainability in the microelectronics sector is not possible without water conservation and reuse. With targeted removal and no byproducts, ElectraMet promotes rinse bath and wastewater reuse to enable sustainability. Onboard analytics provide critical information to drive operational efficiencies and effluent quality.
ElectraMet offers an innovative and modular solution to address these challenges. Using an electrochemical process, ElectraMet’s automated system selectively targets and removes specific metals and impurities from the leachate. This cutting-edge technology can be integrated seamlessly into existing processes, offering several key advantages:
ElectraMet's scalability enables customer production changes without production bottlenecks.
ElectraMet contracts to deliver specification, providing discharge compliance assurance for its customers.
ElectraMet's recovered copper is 99.9% pure, enabling a new revenue stream for customers.
ElectraMet's automation minimizes labor requirements and ensures consistent, trouble-free operations.
Our chemical-free solution eliminates concentrated waste and sludge hauling to improve scope 3 GHG emissions.
Real-time data and diagnostics automate copper removal and recovery to liberate staff and assure process.
ElectraMet operates across all copper concentrations found in microelectronics manufacturing.
ElectraMet removal processes require limited labor intervention. Recovery processes are dictated by the volume of copper extracted from the target stream. The recovery process is demonstrated here.